Electronic device with a charge recycling mechanism

ABSTRACT

An electronic device includes: a clock booster circuit configured to store charges on doubler capacitors therein, wherein each doubler capacitor is connected to a corresponding clock signal; secondary booster circuit including booster capacitors that are each coupled to one of the doubler capacitors, the secondary booster circuit configured to provide one or more stage outputs based on boosting the charges stored on the doubler capacitors; and connecting switches that each connect one of the doubler capacitors to one of the booster capacitors during recycling durations, wherein the recycling duration occurs after generating the one or more stage outputs; wherein the clock signals correspond to a state during the recycling duration.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.16/416,699, filed May 20, 2019; which is a continuation of U.S. patentapplication Ser. No. 15/849,098, filed Dec. 20, 2017, now U.S. Pat. No.10,348,192; each of which is incorporated herein by reference in itsentirety.

This application contains subject matter related to an U.S. patentapplication by Michele Piccardi titled “ELECTRONIC DEVICE WITH AN OUTPUTVOLTAGE BOOSTER MECHANISM.” The related application is assigned toMicron Technology, Inc., and is identified as U.S. patent applicationSer. No. 15/849,052, filed Dec. 20, 2017, now issued as U.S. Pat. No.10,211,724. The subject matter thereof is incorporated herein byreference thereto.

This application contains subject matter related to an U.S. patentapplication by Michele Piccardi titled “ELECTRONIC DEVICE WITH ACHARGING MECHANISM.” The related application is assigned to MicronTechnology, Inc., and is identified as U.S. patent application Ser. No.15/849,137, filed Dec. 20, 2017. The subject matter thereof isincorporated herein by reference thereto.

TECHNICAL FIELD

The disclosed embodiments relate to electronic devices, and, inparticular, to semiconductor devices with a charge recycling mechanism.

BACKGROUND

Electronic devices, such as semiconductor devices, memory chips,microprocessor chips, and imager chips, can include a charge pump (e.g.,a DC to DC converter that functions as a power source) to create avoltage that is different (e.g., higher or lower) than the availablesource voltage (e.g., ‘V_(dd)’). Charge pumps can include components(e.g., diodes, switches, comparators, capacitors, resistors, or acombination thereof) that are organized to provide an output voltagethat is boosted or reduced from an incoming source voltage.

Some charge pumps can include the components arranged in units or stages(e.g., such that the connections between or relative arrangements of theunits can be reconfigured to adjust one or more capabilities of thecharge pump). FIG. 1A, illustrates a single stage of a charge pump in anelectronic device 101. In a pre-charge phase, an energy storagestructure (e.g., one or more capacitors, represented as ‘C_(p)’) in thesingle stage can be charged using an incoming voltage (e.g., ‘V_(in)’).As illustrated in FIG. 1B, the charged storage structure can bereconfigured (e.g., using one or more relays or switches) from aparallel connection with the voltage supply for the pre-charge phase toa series connection with the voltage supply for a boost phase.Accordingly, a resulting output (e.g., ‘V_(out)’) can be higher (e.g.,than the incoming voltage level (e.g. ‘V_(in)’).

The output voltage can be used to drive a load as illustrated in FIG.1C. The boosted output can be connected to the electrical load. The loadcan draw a current (e.g., as represented ‘I_(load)’) and/or a drive aload capacitance (e.g., as represented by a capacitance ‘C_(load)’). Assuch, when the load is connected to the charge pump, the output voltage(e.g., ‘V_(out)’) can drop according to the pump capability. Inproviding the output voltage, charges stored on one or more energystorage structures (e.g., precharging capacitors) can be routed toground during charging cycles and then recharge from zero voltage.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A-C are block diagrams of an electronic device including acharging mechanism.

FIG. 2 is a block diagram of an electronic device including a chargerecycling mechanism in accordance with an embodiment of the presenttechnology.

FIG. 3 is an example circuit diagram of an electronic device inaccordance with an embodiment of the present technology.

FIG. 4 is a further example circuit diagram of an electronic device inaccordance with an embodiment of the present technology.

FIG. 5 is an example timing diagram for an electronic device inaccordance with an embodiment of the present technology.

FIG. 6 is a flow diagram illustrating an example method of operating anelectronic device in accordance with an embodiment of the presenttechnology.

FIG. 7 is a flow diagram illustrating an example method of manufacturingan electronic device in accordance with an embodiment of the presenttechnology.

FIG. 8 is a schematic view of a system that includes an electronicdevice in accordance with embodiments of the present technology.

DETAILED DESCRIPTION

The technology disclosed herein relates to electronic devices (e.g.,semiconductor-level devices, sets of analog circuitry components, etc.),systems with electronic devices, and related methods for operatingelectronic devices in association with charge pumps and/or voltagebooster mechanism (e.g., double boosted charge pumps) therein. Theelectronic devices can include in each stage a clock booster (e.g., a2-phase NMOS clock doubler) for initially boosting an input voltage, aswitching module for routing the initially boosted voltage, and asecondary booster for further boosting the input voltage using theinitially boosted voltage. The electronic devices can operate thecircuitry therein to recycle charges stored in the secondary booster anduse it to precharge in the clock booster instead of discharging thecharges to ground. The electronic devices can use a recycling durationto leave the secondary booster connected to the clock booster instead ofisolating the circuits and connecting the secondary booster to groundfor discharge. The charges stored in the secondary booster can flow intothe clock booster and contribute to the precharging operation.

FIG. 2 is a block diagram of an electronic device 200 (e.g., amulti-stage charge pump) including a charge recycling mechanism inaccordance with an embodiment of the present technology. The electronicdevice 200 (e.g., a semiconductor device, an integrated circuit, a waferor silicon level device, a set of digital and/or analog circuitry, etc.)can include a charge pump (e.g., a DC to DC converter, including one ormore capacitors to store energy, that functions as a power source usingvarious different internal configurations, arrangements, or electricalconnections to provide an output voltage (“V_(out)”)). The charge pumpcan include multiple charging stages 202 (e.g., units of circuits,devices, components, etc. configured to produce a voltage greater thanthe input) connected in series.

Each of the charging stages 202 (e.g., each a double boosted chargepump) can include a clock booster 204 (e.g., an output booster, such asa clock doubler), a secondary booster 206 (e.g., a higher voltagebooster circuit, such as a Favrat booster), and a switching module 208(e.g., a system or a set of switches and electrical connections). Theclock booster 204 can be electrically coupled to the secondary booster206 through the switching module 208. For example, a boostedintermediate voltage 210 (e.g., an intermediate voltage, such as‘2V_(dd)’, that is greater than and/or boosted from a source inputvoltage, such as ‘V_(dd)’) from the clock booster 204 can be routedthrough the switching module 208 and provided as an input at thesecondary booster 206. The secondary booster 206 can use the boostedintermediate voltage 210 from the clock booster 204 to further increasea previous stage input voltage 212 (e.g., ‘V_(dd)’ for the first stageor a stage output voltage 214 from a preceding secondary booster forsubsequent stages). The stage output voltage 214 resulting from boostingthe stage input voltage can be provided as an input voltage to thesubsequent stage (e.g., as the stage input to subsequent instance of thesecondary booster or as an output to the load).

In some embodiments, the switching module 208 can include multipleswitching paths including one or more switches (e.g., parallel pathseach including one or more NMOS transistor), one or more complementaryswitches (e.g., one or more PMOS transistors), or a combination thereof.For example, the switching module 208 can include a first PMOStransistor 222 connected to the clock booster 204 on one end and a firstNMOS transistor 224, the secondary booster 206, or a combination thereofon an opposing end. The switching module 208 can further include asecond PMOS transistor 226 connected to the clock booster 204 on one endand a second NMOS transistor 228, the secondary booster 206, or acombination thereof on an opposing end.

The charging stages 202 including the clock booster 204 and theswitching module 208 (e.g., for providing a voltage greater than theinput voltage, such as ‘2V_(dd)’) with the secondary booster 206 toprovide increased charging efficiency. In comparison to the traditionalswitch pumps, the charge pump illustrated in FIG. 2 can reduce (e.g., bya factor such as 1.1 or greater, including 2.0 or more) the number ofstages (i.e., represented as ‘N’) necessary to produce the same targetvoltage and the corresponding resistance. For example, the maximumvoltage and the corresponding resistance value of the electronic device200 can be represented as:

$\begin{matrix}{V_{\max} = {V_{dd} + {{\frac{N}{2} \cdot 2}{V_{dd}.}}}} & {{Equation}\mspace{14mu} (1)} \\{R_{out} = {\frac{N}{2}\; {\left( {f_{clk} \cdot C_{p}} \right).}}} & {{Equation}\mspace{14mu} (2)}\end{matrix}$

FIG. 3 is an example circuit diagram of an electronic device 300 inaccordance with an embodiment of the present technology. The electronicdevice 300 can include a clock doubler 302 (e.g., similar to the clockbooster 204 of FIG. 2), a secondary booster 304 (e.g., similar to thesecondary booster 206 of FIG. 2), and a switching module 306 (e.g.,similar to the switching module 208 of FIG. 2).

In some embodiments, the clock doubler 302 can include a doublercapacitor 322 connected to a source switch 324 on one node and a doublercharging switch 326 on an opposite node. Opposite the doubler capacitor322, the source switch 324 can be connected to a power source (e.g., foraccessing an input voltage 386, represented as ‘V_(dd)’) and the doublercharging switch 326 can be connected to a periodic signal used togenerate the boosted intermediate voltage 210 of FIG. 2.

In some embodiments, the switching module 306 can include a connectingswitch 342 for controlling an electrical connection between the clockdoubler 302 and the secondary booster 304. When closed or turned on, theconnecting switch 342 can connect the clock doubler 302 and thesecondary booster 304 to provide the boosted output to the secondarybooster 304. When open or turned off, the connecting switch 342 canelectrically isolate the clock doubler 302 and the secondary booster304.

The switching module 306 can further include a discharging switch 344between the connecting switch 342 and the secondary booster 304configured to discharge energy from the secondary booster 304 to ground.The discharging switch 344 can generally operate in a complementarymanner to the connecting switch 342. For example, for the dischargingoperation, the discharging switch 344 (e.g., based on closing or turningon) can connect the secondary booster 304 to ground when the connectingswitch 342 (e.g., based on opening or turning off) isolates the clockdoubler 302 from the secondary booster 304. For the charging or boostingoperation, the discharging switch 344 (e.g., based on opening or turningoff) can isolate the secondary booster from ground when the connectingswitch 342 (e.g., based on closing or turning on) connects the clockdoubler 302 and the secondary booster 304.

Additionally, for discharging the secondary booster 304, the switchingmodule 306 can operate to recycle at least part of the energy in thesecondary booster 304 and send it to the clock doubler 302 instead ofdischarging all of the remaining charges to a lower potential node(e.g., electrical ground). The clock doubler 302 can use the remainingcharges to precharge the doubler capacitor 322, which can improveoverall efficiency based on reducing a charging duration required tocharge the doubler capacitor 322 and/or demand on the power source(e.g., based on going from a positive voltage level to V_(dd) instead offrom zero volts). To recycle the charges, the connecting switch 342 canremain closed/on and the discharging switch 344 can remain open/off fora portion of the discharging operation.

The recycling process can utilize the remaining charges from a boostercapacitor 362 in the secondary booster 304. The secondary booster 304can use the booster capacitor 362 with an input switch 364 and an outputswitch 366 to further boost the boosted intermediate voltage 210 and/orthe input voltage 386 during a charging operation (e.g., based on arising edge of the periodic signal controlling the charging operation).For the discharging operation (e.g., based on a falling edge of theperiodic signal), the charges stored on the booster capacitor 362 can bedischarged or removed as discussed above.

For the recycling process, the charges from the booster capacitor 362can contribute to or increase a precharging voltage 382 (e.g.,represented as ‘V_(precharge)’) at the doubler capacitor 322.Separately, the booster capacitor 362 can have an intermediate nodevoltage 384 (e.g., represented as ‘V_(x)’) at a port or a node connectedto the connecting switch 342. When the connecting switch 342 is closed(e.g., when the doubler capacitor 322 is discharged or at a lowerpotential than the intermediate node voltage 384), recycled charge 390can go from the booster capacitor 362 to the doubler capacitor 322(e.g., with the intermediate node voltage 384 matching the prechargingvoltage 382 (V_(x)=V_(precharge)) as a result). The intermediate nodevoltage 384 can decrease (e.g., by an amount corresponding to therecycled charge 390) based on a capacitance level of the doublercapacitor 322, the booster capacitor 362, or a combination thereof.

After recycling, the connecting switch 342 can open to isolate the clockdoubler 302 from the secondary booster 304 (e.g., isolating the doublercapacitor 322 and the booster capacitor 362). The electronic device 300can remove discharge loss 388 (e.g., charges that remain on the boostercapacitor 362 after the recycling process) from the booster capacitor362 based on closing the discharging switch 344.

Also after the recycling, the electronic device 300 can further increasethe precharging voltage 382 using source-charging energy 392 from theinput source to the doubler capacitor 322. The electronic device 300 canincrease the precharging voltage 382 based on closing the source switch324 and connecting the doubler capacitor 322 to the input voltage 386.

FIG. 4 is a further example circuit diagram of an electronic device 400in accordance with an embodiment of the present technology. Theelectronic device 400 (e.g., double boosted charge pumps utilizingmaster-slave configuration) can include a clock booster 402 (e.g.,similar to the clock doubler 302 of FIG. 3) having a master-controller404 and a slave-booster 406. The master-controller 404 can be configuredto operate the slave-booster 406 (e.g., for controlling the chargingoperation), and the slave-booster 406 can be configured to drive theload (e.g., the secondary booster 304). For example, themaster-controller 404 can include one or more controller switches 412(e.g., similar to the source switch 324 of FIG. 3 but for controloperations instead of the charging/driving operation) connected to oneor more controller capacitors 416 (e.g., similar to the doublercapacitor 322 of FIG. 3 but for control operations instead of thecharging/driving operation). The controller capacitors 416 can befurther connected to gates of the controller switches 412, and canoperate based on clock master signals 434 (e.g., represented as‘CLK_MSTR’ and ‘!CLK_MSTR’ that represents an opposite or acomplementary signal of CLK_MSTR).

The slave-booster 406 can include a driver switch 422 (e.g., similar tothe source switch 324 but for the charging/driving operation instead ofthe control operations) connected to a driver capacitor 424 (e.g.,similar to the doubler capacitor 322 but for the charging/drivingoperation instead of the control operations). For example, a gate of thedriver switch 422 can be connected to one of the controller switches 412and/or one of the controller capacitors 416. The driver capacitor 424can be controlled based on clock signals 432 (e.g., represented as ‘CLK’(not shown) or ‘!CLK’ that represents an opposite or a complementarysignal of ‘CLK’). The driver capacitor 424 can further have greatercapacitance than the controller capacitors 416 (e.g., based on a factorof 10 or more, such as for controlling based on the controllercapacitors 416 and for driving the load based on the driver capacitor424).

The slave-booster 406 can be connected to the secondary booster 304through the switching module 306 of FIG. 3. For example, theslave-booster 406 can be directly connected to a module first switch 426(e.g., the connecting switch 342 of FIG. 3, which can be implemented asa PMOS transistor, such as the first PMOS 222 of FIG. 2, the second PMOS226 of FIG. 2, etc.) in the switching module 306. The module firstswitch 426 can connect the driver capacitor 424 to the booster capacitor362 (e.g., for charging the intermediate node voltage 384 and/orrecycling the charges on the booster capacitor 362 for the prechargingprocess).

The switching module 306 can further include a module second switch 428(e.g., the discharging switch 344 of FIG. 3, which can be implemented asan NMOS transistor, such as the first NMOS 224 of FIG. 2, the secondNMOS 228 of FIG. 2, etc.) for discharging the intermediate node voltage384. The module second switch 428 can connect the booster capacitor 362to ground or a lower potential/voltage node. The switching module 306can include the module first switch 426 and/or the module second switch428 instead of a simple inverter.

The switching module 306 can operate the switches based on a modulefirst signal 436, a module second signal 438, or a combination thereof.The module first signal 436 can operate the module first switch 426 andthe module second signal 438 can operate the module second switch 428.For example, the module first signal 436 can connect the module firstswitch 426 (e.g., based on turn the switch on) for a charging/drivingprocess (e.g., rising edge of one or more of the clock master signals434 and/or the clock signals 432) and for the recycling process. Themodule second signal 438 can connect the module second switch 428 for adischarging process (e.g., after the recycling process).

For illustrative purposes, the electronic device is shown in FIG. 3 andFIG. 4 with one path/circuit set for the clock doubler 302 and thesecondary booster 304. However, it is understood that the circuits canbe mirrored (e.g., one set corresponding to one of the clock signalsand/or one of the clock_master signals and the mirroring setcorresponding to the other or complementary/negated form of the clocksignal).

Also for illustrative purposes, non-ideal losses to ground (e.g.,corresponding to capacitor implementations, such as residual substratecapacitances for CMOS implementations) for the boosting and/orclock-doubler capacitors have been shown as dotted lines representingcapacitances to ground. The charge recycling operations discussed hereincan compensate for the non-ideal losses in the clock-doubler capacitorsand/or the secondary booster capacitors.

FIG. 5 is an example timing diagram 500 for an electronic device (e.g.,the electronic device 200 of FIG. 2, the electronic device 300 of FIG.3, the electronic device 400 of FIG. 4, etc.) in accordance with anembodiment of the present technology. The example timing diagram 500 canillustrate an example relationship (e.g., a temporal relationship)between input signals (e.g., the clock signals 432 such as the clocksignal and the negated signal, the clock master signals 434 such as theclock master signal and the negated master signal, the module firstsignal 436 represented as ‘CLK_P,’ the module second signal 438represented as ‘CLK_N,’ etc.) for the electronic device. The exampletiming diagram 500 can be for operating the clock doubler 302 of FIG. 3(e.g., the master-controller 404 of FIG. 4 and/or the slave-booster 406of FIG. 4 of the clock booster 402 of FIG. 4), the switching module 306of FIG. 3, a portion thereof, or a combination thereof illustrated inFIG. 4.

The timing for input signals can be based on a recycling duration 502(e.g., a duration for recycling the source-charging energy 392 and/orthe recycled charge 390 from the booster capacitor 362 of FIG. 3 to thedriver capacitor 424 of FIG. 4). In some embodiments, the recyclingduration 502 can be a duration lasting 0.1 ns or more.

The input signals can keep or operate the connecting switch 342 of FIG.3 (e.g., the module first switch 426 of FIG. 4) closed while the bottomplate of the driver capacitor 424 is pulled low and/or the bottom plateof the control capacitor controlling the driver switch 422 for thedriver capacitor 424 is low (e.g., while the gate voltage for the driverswitch 422 is also low). For example, the clock signals 432 (e.g., boththe clock signal and the negated signal) can be low during the recyclingduration 502 to pull the lower plate of the driver capacitors low. Theclock master signals 434 (e.g., both the master clock signal and thenegated master signal) can remain in their signal states during therecycling duration 502. The clock master signal that is for controllingthe slave-booster 406 (or a portion thereof) can remain low during therecycling duration 502. In reference to FIG. 4 and FIG. 5, the CLK_MSTRsignal (e.g., for controlling the driver switch 422 connected to thedriver capacitor 424) can remain low during the recycling duration 502while the clock signals 432 (e.g., both the CLK and !CLK) remain low.Accordingly, the gate voltage for the driver switch 422 (e.g., ‘V_(g)’)can be low.

Also during the recycling duration 502, the module first signal 436 canbe low (e.g., for PMOS, a negative pulse with a pulse width equal to therecycling duration 502) for connecting the module first switch 426 anddischarging the intermediate node voltage 384 from the booster capacitor362 to the driver capacitor 424. As such, the intermediate node voltage384 can be reduced according to the recycled charge 390 and/or thesource-charging energy 392 (e.g. from 2V_(dd) to V_(dd)).

After the recycling duration, the clock signals 432, the clock mastersignals 434, or a combination thereof can resume the periodic portionsfor operating/precharging the clock booster 402 of FIG. 4. Further, themodule first signal 436 can return to high magnitude for turning off oropening the module first switch 426 (e.g., PMOS) and isolating thesecondary booster 304 from the clock booster 402 after recycling thecharges. The module second signal 438 can further go high magnitude forturning on or closing the module second switch 428 (e.g., NMOS) andconnecting the booster capacitor 362 to ground. Accordingly, theremaining charges on the booster capacitor 362 can be discharged toground (e.g., the discharge loss 388 corresponding to the intermediatenode voltage 384 going from V_(dd) to zero volts).

Recycling the recycled charge 390 from the booster capacitor 362 to thedoubler capacitor 322 through the connecting switch 342 providesincreased efficiency for charging capacitors. Based on the recycling,the device can begin charging the doubler capacitor 322 having therecycled charge 390 thereon instead of charging from zero voltage.Accordingly, recycling the recycled charge 390 instead of discharging toground as the discharge loss 388 can reduce the source-charging energy392 in comparison to charging from zero voltage.

FIG. 6 is a flow diagram illustrating an example method 600 of operatingan electronic device in accordance with an embodiment of the presenttechnology. The method 600 can be for operating the electronic device200 of FIG. 2, the electronic device 300 of FIG. 3, the electronicdevice 400 of FIG. 4, a portion therein, or a combination thereof.

At block 602, the electronic device (e.g., a charge pump, such as adouble-boosted charge pump) can initiate (e.g., using the clock booster204 of FIG. 2, the clock doubler 302 of FIG. 3, the clock booster 402 ofFIG. 4, a state machine or a controller circuit, etc.) the chargingoperating based on precharging a first capacitor (e.g., the doublercapacitor 322 of FIG. 3, the driver capacitor 424 of FIG. 4, etc.). Forprecharging, the electronic device can charge the first capacitor to theboosted intermediate voltage 210 of FIG. 2, the precharging voltage 382of FIG. 3, or a combination thereof that is greater than the inputvoltage 386 of FIG. 3 (e.g., V_(precharge) equals or is within apredetermined range from 2V_(dd)).

The electronic device can precharge based on charging signals (e.g., theclock signals 432 of FIG. 4, the clock master signals 434 of FIG. 4,etc.). For example, the clock doubler 302 and/or the slave-booster 406of FIG. 4 can precharge based on the clock signals 432 (e.g., CLK and/or!CLK) connected to and/or charging a gate/plate of the first capacitor(e.g., during the rising edge and/or upper portion of the clock signals432) opposite the supply for the input voltage 386 and/or the driverswitch 422 of FIG. 4, the source switch 324 of FIG. 3, etc. Accordingly,the precharging operation can generate the boosted intermediate voltage210, the precharging voltage 382, or a combination thereof at the firstcapacitor.

In some embodiments, the electronic device can precharge using the clockmaster signals 434 (e.g., CLK_MSTR and/or !CLK_MSTR,). For example, theelectronic device (e.g., for double-boosted charge pumps includingmaster-slave configuration) can include the master-controller 404 ofFIG. 4 (e.g., circuit configured to control charging operations of theconnected slave circuit) and the slave-booster 406 of FIG. 4 (e.g.,circuit, which includes the first capacitor, configured to supplyvoltage to the connected load). The master-controller 404 can operateand control the slave-booster 406 based on the clock master signals 434(e.g., based on the clock master signals 434 driving a portion or a nodeof the controller capacitors 416 of FIG. 4 opposite the input voltage386, the controller switches 412, or a combination thereof). Theslave-booster 406 can precharge the first capacitor based on the clocksignals 432. In some embodiments, the clock master signals 434 and theclock signals 432 can be non-overlapping signals (e.g., during therecycling duration 502 of FIG. 5).

At block 604, the electronic device can generate an output (e.g., thestage output voltage 214 of FIG. 2) with a second capacitor (e.g., thebooster capacitor 362 of FIG. 3) electrically connected to the firstcapacitor. For example, the switching module 208 of FIG. 2 (e.g., suchas the switching module 306 of FIG. 3) can connect the first capacitorto the second capacitor for generating the output. The boostedintermediate voltage 210 (e.g., the voltage level at the first capacitorresulting from the precharging operation) can be routed through (e.g.,based on closing the connecting switch 342 of FIG. 3, the module firstswitch 426 of FIG. 4, or a combination thereof and/or opening thedischarging switch 344 of FIG. 3, the module second switch 428 of FIG.4, or a combination thereof) the switching module 208 for charging thebooster capacitor 362 in the secondary booster 206 of FIG. 2 and/or thesecondary booster 304 of FIG. 3 and generating the output.

At block 606, the electronic device can recycle charges from the secondcapacitor to charge the first capacitor. For example, after generatingthe output (e.g., charging the booster capacitor 362), the electronicdevice can recycle charges (e.g., during the recycling duration 502,during or prior to a falling edge and/or a lower portion of one or morecharging signals, or a combination thereof) from the booster capacitor362 to charge the doubler capacitor 322, the driver capacitor 424, or acombination thereof.

For recycling, at block 662, the electronic device can set, control,and/or drive the charging signals (e.g., the clock signals 432, theclock master signals 434, a portion or a segment thereof, or acombination thereof). For example, the electronic device (e.g., using acontrolling circuit, a state machine, other circuits within the device,etc.) can set the clock signals 432 low (e.g., for preventing ordelaying the precharging operation). The electronic device can set theclock signals 432 based on delaying a rising portion of the clocksignals 432 (e.g., the CLK signal) after the corresponding complementarysignals (e.g., the !CLK signal) goes low. The electronic device can usethe clock signals 432 that are complementary, but not overlapping eachother (e.g., during the recycling duration 502, which can occur everyhalf cycle of the clock signals 432 where one of the clock signals 432is low, the other of the clock signals 432 can also remain low).

In some embodiments, the electronic device can maintain the states orlevels of the clock master signals 434 during the recycling duration502. For example, as illustrated in FIG. 5, the !CLK_MSTR can remainhigh and CLK_MSTR can remain low during the recycling duration 502.Accordingly, the electronic device can control or use the clock mastersignals 434 that are non-overlapping or different from the clock signals432 (e.g., the state or level transitions of the clock master signals434 can be synchronized or contemporaneous with a rising transition ofthe clock signals 432 and not the falling transitions thereof).

Also for recycling, at block 664, the electronic device can operateswitches for the switching module 208 and/or the switching module 306.The electronic device can operate the connecting switch 342, the modulefirst switch 426, the discharging switch 344, the module second switch428, or a combination thereof during the recycling duration 502 for therecycling operation. For example, the electronic device can control orset the module first signal 436 of FIG. 4 to close or connect theconnecting switch 342, the module first switch 426, or a combinationthereof during the recycling duration 502 to electrically connect theclock doubler and the secondary booster (e.g., based on directlyconnecting the first capacitor to the second capacitor). Also forexample, the electronic device can control or set the module secondsignal 438 of FIG. 4 to open or disconnect (e.g., based on keeping theswitches in the open/disconnected state as illustrated in FIG. 5) thedischarging switch 344, the module second switch 428, or a combinationthereof during the recycling duration 502 to electrically isolate thebooster capacitor 362 from electrical ground or a voltage level lowerthan the intermediate node voltage.

Based on the charging signals and the switch operations, the recycledcharge 390 can transfer or flow from the booster capacitor 362 to thedoubler capacitor 322/the driver capacitor 424 through the connectingswitch 342/the module first switch 426 during the recycling duration502. Accordingly, the discharging/recycling of the recycled charge 390can reduce the intermediate node voltage 384 of FIG. 3 at the boostercapacitor 362 (e.g., reducing from a voltage level that resulted fromcharging the booster capacitor before the recycling duration 502). Forexample, the intermediate node voltage 384 can go from 2V_(dd) toV_(dd), and the corresponding recycled charge can charge the doublercapacitor 322/the driver capacitor 424 to V_(dd) (e.g., for matchingcapacitance levels between the connected capacitors) or a differentvoltage that corresponds to a difference in capacitance level betweenthe connected capacitors.

At block 608, the electronic device can discharge the second capacitorand removed the charges remaining after the recycling duration 502. Atthe end of the recycling duration 502, the electronic device can operatethe switches, control the charging signals, or a combination thereof todischarge the intermediate node voltage 384 remaining afterdischarging/recycling the recycled charge 390.

At block 682, the electronic device can open or disconnect theconnecting switch 342/the module first switch 426 at the end of therecycling duration 502 for the discharging operation. For example, theelectronic device can set or control the module first signal 436 or acorresponding signal to open or disconnect the connecting switch 342/themodule first switch 426, thereby isolating the second capacitor from thefirst capacitor.

At block 684, the electronic device can close or connect the dischargingswitch 344/the module second switch 428 for the discharging operation.For example, at the end of the recycling duration 502 and/or after orcontemporaneous with block 682, the electronic device can set or controlthe module second signal 438 or a corresponding signal to close orconnect the discharging switch 344/the module second switch 428, therebyconnecting the second capacitor to the electrical ground or the lowervoltage level.

At block 686, the electronic device can control or set the chargingsignals. For example, the electronic device can set or drive one of theclock signals 432 (e.g., the signal complementary to the one that wentlow immediately before the recycling duration 502) low after or at theend of the recycling duration 502. Also for example, the electronicdevice can set or drive the clock master signals 434 to change states(e.g., transitioning from high to low or from low to high) after or atthe end of the recycling duration 502.

The electronic device can discharge the intermediate node voltage 384 atthe booster capacitor 362 (e.g., charges remaining afterdischarging/recycling the recycled charge 390) based on the chargingsignals and/or the switch settings. Further, the electronic device canbegin the precharging process for charging the first capacitor after therecycling duration 502. Accordingly, the precharging process can chargethe first capacitor having the recycled charge 390 thereon instead offrom zero volt potential. As a result, the recycling operation canincrease the efficiency of the overall charging operation by decreasingthe source-charging energy 392 of FIG. 3 that is necessary to prechargethe first capacitor.

FIG. 7 is a flow diagram illustrating an example method 700 ofmanufacturing an electronic device in accordance with an embodiment ofthe present technology. The method 700 can be for manufacturing theelectronic device 200 of FIG. 2, the electronic device 300 of FIG. 3,the electronic device 400 of FIG. 4, a portion therein, or a combinationthereof.

At block 702, circuit for the charge pump (e.g., the electronic device200 of FIG. 2, the electronic device 300 of FIG. 3, the electronicdevice 400 of FIG. 4, a portion therein, or a combination thereof) canbe provided. Providing the circuit can include forming the circuit(e.g., on a silicon wafer based on wafer-level processes), connecting orassembling circuitry components, or a combination thereof.

At block 722, providing the circuit can further include providingswitches, such as the connecting switch 342 of FIG. 3 (e.g., the modulefirst switch 426 of FIG. 4), the discharging switch 344 of FIG. 3 (e.g.,the module second switch 428 of FIG. 4), or a combination thereof. Theconnecting switch 342 can be directly connected to the clockdoubler/booster (e.g., the first capacitor therein) on one side/node anddirectly connected to the secondary booster on the opposite side/node ofthe booster capacitor 362.

At block 704, the circuit can be configured for signal timings. Forexample, the circuit can be connected or manufactured (e.g., based onsilicon-level processing or connecting circuit components) to implementthe signal timings (e.g., as illustrated in FIG. 5). Also for example,firmware or software can be loaded for implementing the signal timingswith the circuit.

At block 742, configuring the circuit can include configuring thecharging signals. For example, the state machine or the controllercircuit can be configured or the firmware/software can be loaded forcontrolling the clock signals 432 of FIG. 4, the clock master signals434 of FIG. 4, or a combination thereof. Also for example, the circuitcan be provided with circuits for generating periodic signals (e.g., forclock-type signals) for implementing the clock signals 432, the clockmaster signals 434, or a combination thereof. The charging signals canbe configured relative to or for implementing the recycling duration 502of FIG. 5 (e.g., for keeping the clock signals 432 low and/ormaintaining the clock master signals 434 during the recycling duration502 following immediately after a falling edge of the clock signals432).

At block 744, configuring the circuit can include configuring the switchtiming. For example, the state machine or the controller circuit can beconfigured or the firmware/software can be loaded for controlling themodule first signal 436 of FIG. 4, the module second signal 438 of FIG.4, or a combination thereof. The module first signal 436 can beconfigured to connect or close the module first switch 426 of FIG. 4 orthe connecting switch 342 of FIG. 3 during the recycling duration 502.The module second signal 438 can be configured to close or connect themodule second switch 428 of FIG. 4 or the discharging switch 344 of FIG.3 after the recycling duration 502 and/or during a low portion/cycle ofthe corresponding one of the clock signals 432, the corresponding one ofthe clock master signals 434, or a combination thereof.

FIG. 8 is a schematic view of a system that includes an electronicdevice in accordance with embodiments of the present technology. Any oneof the semiconductor devices having the features described above withreference to FIGS. 1-7 can be incorporated into any of a myriad oflarger and/or more complex systems, a representative example of which issystem 890 shown schematically in FIG. 8. The system 890 can include aprocessor 892, a memory 894 (e.g., SRAM, DRAM, flash, and/or othermemory devices), input/output devices 896, and/or other subsystems orcomponents 898. The semiconductor assemblies, devices, and devicepackages described above with reference to FIGS. 1-7 can be included inany of the elements shown in FIG. 8. The resulting system 890 can beconfigured to perform any of a wide variety of suitable computing,processing, storage, sensing, imaging, and/or other functions.Accordingly, representative examples of the system 890 include, withoutlimitation, computers and/or other data processors, such as desktopcomputers, laptop computers, Internet appliances, hand-held devices(e.g., palm-top computers, wearable computers, cellular or mobilephones, personal digital assistants, music players, etc.), tablets,multi-processor systems, processor-based or programmable consumerelectronics, network computers, and minicomputers. Additionalrepresentative examples of the system 890 include lights, cameras,vehicles, etc. With regard to these and other examples, the system 890can be housed in a single unit or distributed over multipleinterconnected units, e.g., through a communication network. Thecomponents of the system 890 can accordingly include local and/or remotememory storage devices and any of a wide variety of suitablecomputer-readable media.

From the foregoing, it will be appreciated that specific embodiments ofthe present technology have been described herein for purposes ofillustration, but that various modifications may be made withoutdeviating from the disclosure. In addition, certain aspects of thedisclosure described in the context of particular embodiments may becombined or eliminated in other embodiments. Further, while advantagesassociated with certain embodiments have been described in the contextof those embodiments, other embodiments may also exhibit suchadvantages. Not all embodiments need necessarily exhibit such advantagesto fall within the scope of the present disclosure. Accordingly, thedisclosure and associated technology can encompass other embodiments notexpressly shown or described herein.

I/We claim:
 1. An electronic device, comprising: a clock booster circuitconfigured to store charges on doubler capacitors therein, wherein eachdoubler capacitor is connected to a corresponding clock signal; asecondary booster circuit including booster capacitors that are eachcoupled to one of the doubler capacitors, the secondary booster circuitconfigured to provide one or more stage outputs based on boosting thecharges stored on the doubler capacitors; and connecting switches thateach connect one of the doubler capacitors to one of the boostercapacitors during recycling durations, wherein the recycling durationoccurs after generating the one or more stage outputs; wherein the clocksignals correspond to a state during the recycling duration.
 2. Theelectronic device of claim 1, wherein: each of the connecting switchesis directly connected to the corresponding doubler capacitor on one sideand directly connected to the corresponding booster capacitor on anopposing side; and the connecting switches are configured to providerecycled currents from the booster capacitors to the correspondingdoubler capacitors during the recycling durations.
 3. The electronicdevice of claim 1, further comprising discharging switches eachconnected to one of the booster capacitors and configured to at leastpartially remove charges remaining after the recycling durations.
 4. Theelectronic device of claim 3, wherein the connecting switches and thedischarging switches are connected without an inverter between the clockbooster circuit and the secondary booster circuit.
 5. The electronicdevice of claim 3, wherein the connecting switches are complementary tothe discharging switches.
 6. The electronic device of claim 5, whereinthe connecting switches include either PMOS transistors or NMOStransistors, and the discharging switches include either the PMOStransistors or the NMOS transistors complementary to the first andsecond connecting switches, wherein the discharging switches providepaths to ground.
 7. The electronic device of claim 1, wherein the clockbooster circuit includes: slave booster circuits each including one ofthe doubler capacitors, the slave booster circuits configured to providecharges for the secondary booster circuit; and a master-controllerdirectly connected to the slave booster circuits, the master-controllerconfigured to operate the slave booster circuits to provide the chargesto the secondary booster circuit, wherein the master-controller does notdirectly charge to the secondary booster circuit.
 8. The electronicdevice of claim 7, wherein: each of the doubler capacitors is connectedto one of clock signals opposite the corresponding connecting switch;and the master-controller includes controller capacitors that are eachconnected to one of the slave booster circuits on one side and one ofclock master signals on an opposite side.
 9. The electronic device ofclaim 8, further comprising a control circuit configured to: set theclock signals low during the recycling durations; maintain the clockmaster signals at preceding states during the recycling durations; andactivate the first and second connecting switch during the recyclingdurations.
 10. The electronic device of claim 9, wherein: the clocksignals are complementary to each other for more than half of the timesoutside of the recycling durations; and the clock master signals arecomplementary to each other for more than half of the times outside ofthe recycling durations.
 11. A method of operating an electronic deviceincluding a clock doubler circuit including doubler capacitors and asecondary booster circuit, comprising: setting clock signals to lowstates during a recycling duration, wherein the clock signals are eachconfigured to charge a corresponding doubler capacitor within the clockdoubler circuit; closing one or more connecting switches to electricallyconnect the clock doubler circuit to the secondary booster circuitduring the recycling duration; and providing a recycled charge from thesecondary booster circuit to one or more of the doubler capacitorsthrough the closed one or more connecting switches during the recyclingduration.
 12. The method of claim 11, further comprising: charging oneor more booster capacitors in the secondary booster based on charges onthe one or more of the doubler capacitors; and wherein: providing therecycled charge includes providing the recycled charge resulting fromcharging the booster capacitor before the recycling duration.
 13. Themethod of claim 12, wherein charging the booster capacitor includesprecharging the one or more of the doubler capacitors with the clockdoubler circuit based on one or more of the clock signals.
 14. Themethod of claim 11, wherein: providing the recycled charge includesreducing a charge stored on at a booster capacitor in the secondarybooster circuit; and further comprising: removing remaining charge afterproviding the recycled charge, wherein removing the remaining chargeoccurs after the recycling duration.
 15. The method of claim 14,wherein: providing the recycled charge includes keeping a dischargingswitch open during the recycling duration for isolating the boostercapacitor from a lower voltage node; removing the remaining chargeincludes: opening the connecting switch to isolate the doublercapacitors from the booster capacitor; and closing the dischargingswitch to connect the booster capacitor to the lower voltage node.
 16. Amethod of operating a charge pump, comprising: precharging doublercapacitors to store boosted intermediate voltages using complementaryclock signals; providing pump outputs at corresponding boostercapacitors based on the boosted intermediate voltages; providingrecycled charges from the booster capacitors to the doubler capacitorsafter generating the pump outputs, wherein: the recycled charges arereceived at the doubler capacitors, and providing the recycled chargesincludes driving the complementary clock signals low; and dischargingremaining charges from the booster capacitors to electrical ground afterproviding the recycled charge.
 17. The method of claim 16, wherein:providing the recycled charge includes: providing a direct electricalconnection between one of the doubler capacitors and corresponding oneof the booster capacitors during a recycling duration, and providing anelectrical open between the one of the booster capacitors and electricalground during the recycling duration; and discharging the remainingcharge includes: removing the electrical connection between the one ofthe double capacitors and the corresponding one of the boostercapacitors after the recycling duration, and providing an electricalconnection between the one of the booster capacitors and the electricalground after the recycling duration.
 18. The method of claim 17,wherein: precharging the doubler capacitors includes: charging thedoubler capacitors based on a clock master signal, a negated mastersignal, or a combination thereof; and discharging the recycled chargeincludes maintaining during the recycling duration levels of the clockmaster signal, the negated master signal, or a combination thereofoccurring before the recycling duration.
 19. An electronic device,comprising: a first charge pump circuit and a second charge pump circuitconfigured to generate outputs greater than a supply voltage, wherein:the first and second charge pump circuits are complementary; and thefirst and second charge pump circuits each include: a first stagecircuit including a master circuit configured to operate a slave circuitto precharge a first stage capacitor therein; a second stage circuitcoupled to the slave circuit to generate one of the outputs using asecond stage capacitor therein based on boosting precharged voltagelevels at the first stage capacitor; and providing charges on the secondstage capacitor to the first stage capacitor after generating the one ofthe outputs; and wherein: the first stage circuit is configured toprecharge the first stage capacitor having a voltage potential aboveelectrical ground based on the charges provided from the second stagecapacitor.
 20. The electronic device of claim 19, wherein the first andsecond charge pump circuits are configured to operate according to: acomplementary set of master clock signals to connect the first stagecapacitor within each of the first and second charge pump circuits to asupply voltage for precharging, and a complementary set of clock signalsto boost the precharged voltage levels at the double capacitor; wherein:the charges on the second stage capacitor are provided to the firststage capacitor during a recycle duration; levels of the complementaryset of master clock signals occurring before the recycle duration aremaintained during the recycle duration; and the complementary set ofclock signals are driven a common state during the recycle duration.